• Jun 01, 2020 News!Papers published in Vol.10, No.2 have all received dois from Crossref.
  • May 15, 2020 News!Papers published in Vol.9, No.1-Vol.10, No.1 have all received dois from Crossref.
  • May 15, 2020 News!IJIEE Vol. 10, No. 2 issue has been published online!   [Click]
General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2014 Vol.4(3): 225-229 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2014.V4.438

Design of Ku-Band Substrate Integrated Waveguide Phase Shifter

Bouchra Rahali and Mohammed Feham
Abstract— Recently, there has been a lot of interest in the substrate integrated waveguide (SIW) technology concept allowing the integration of waveguides in the substrate, replacing the rectangular metal waveguide sidewalls by two rows of metal rods. The electric field distribution in the rectangular waveguide SIW, denoted RSIW, is similar to that of a conventional rectangular waveguide. In this paper, a Ku-band substrate integrated waveguide phase shifter is conceived and optimized by Ansoft HFSS code.

Index Terms— Rectangular wave guide, microwave components , SIW, phase shifter, HFSS.

Bouchra Rahali and Mohammed Feham are with STIC Laboratory, University of Tlemcen Algeria, Algeria (e-mail: b_rahali@hotmail.fr).

[PDF]

Cite: Bouchra Rahali and Mohammed Feham, " Design of Ku-Band Substrate Integrated Waveguide Phase Shifter," International Journal of Information and Electronics Engineering vol. 4, no. 3, pp. 225-229, 2014.

Copyright © 2008-2021. International Journal of Information and Electronics Engineering. All rights reserved.
E-mail: ijiee@ejournal.net