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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2015 Vol.5(6): 433-436 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2015.V5.573

A Microcontroller-Based Egg Candling System

Akanji S. Saidu and Abdussamad U. Jibia
Abstract— This paper presents a new microcontroller-based egg candling system. The system, which is integrated to a complete automated hatching machine, utilizes an IR transmitter and a highly sensitive TSOP receiver. A 40 KHz signal is passed through a partially incubated egg and received at the other end. Distortion in the frequency of the received signal indicates the presence of a live embryo indicating that the process of hatching should continue. An undistorted signal indicates the absence of life in the egg and the process of hatching is terminated. Two sets of stepper motors are used for the mechanism of the Candler. The system was tested using chick and quail eggs and performance is excellent.

Index Terms— Candling, egg, incubation, microcontroller.

S. S. Akanji is with the Department of Electrical/Electronics Engineering, Sokoto State Polytechnic, Nigeria (e-mail: talktosunbo2002@yahoo.com).
A. U. Jibia is with the Department of Mechatronics Engineering, Bayero University Kano, Nigeria (e-mail: ajumar@buk.edu.ng).

[PDF]

Cite: Akanji S. Saidu and Abdussamad U. Jibia, " A Microcontroller-Based Egg Candling System," International Journal of Information and Electronics Engineering vol. 5, no. 6, pp. 433-436, 2015.

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