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General Information
    • ISSN: 2010-3719
    • Frequency: Bimonthly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Associate Executive Editor: Ms. Jennifer Zeng
    • Executive Editor: Mr. Ron C. Wu
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest, Ei (INSPEC, IET).
    • E-mail ijiee@ejournal.net

Faculty of Science, University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, IJIEE will be recognized among the readers in the related field."
IJIEE 2016 Vol.6(2): 139-142 ISSN: 2010-3719
DOI: 10.18178/IJIEE.2016.6.2.611

Design of a Novel Non-Invasive Wearable Device for Array Surface Electromyogram

Wenguang Jin, Yidong Li, and Shangyao Lin
Abstract—This paper describes the design of a novel non-invasive wearable device that acquires 128-channels array surface electromyogram (sEMG) in real-time. The device contains 8 individual microcontroller-based acquisition modules and a data fusion module. The acquisition modules share the same structure, and the data fusion module is an ARM-based platform running the Linux operating system. A 16-channel matrix-type (2×8) electrode array patch is used in each acquisition module to parallel acquire sEMG signals, which are digitalised by 2 ADCs. Every 100 ms, the sEMG from 8 acquisition modules are packed in the ARM controller and transferred to PC via WIFI. The sEMG signals are filtered with infinite impulse response recursive least-squares adaptive filter (IIR RLS) on PC.

Index Terms—Surface electrode array, sEMG, signal acquisition, wearable device.

The authors are with the College of Information Science and Electronic Engineering, Zhejiang University, China (e-mail: jinguang@zju.edu.cn, pzdongdong@163.com, zjulsy@zju.edu.cn).


Cite:Wenguang Jin, Yidong Li, and Shangyao Lin, "Design of a Novel Non-Invasive Wearable Device for Array Surface Electromyogram," International Journal of Information and Electronics Engineering vol. 6, no. 2, pp. 139-142, 2016.

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