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General Information
    • ISSN: 2010-3719
    • Frequency: Bimonthly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Associate Executive Editor: Ms. Jennifer Zeng
    • Executive Editor: Mr. Ron C. Wu
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest, Ei (INSPEC, IET).
    • E-mail ijiee@ejournal.net

Faculty of Science, University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, IJIEE will be recognized among the readers in the related field."
IJIEE 2013 Vol.3(1): 20-23 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2013.V3.256

Low Noise Low Power Preamplifier for Integrated Ultrasound Needle Intervention Application

Dipankar Nag, Jia Hao Cheong, and Minkyu Je

Abstract—This paper presents the design and implementation of a fully integrated trans-impedance amplifier (TIA) as the pre-amplifier of analog front-end for ultrasound needle intervention application. The application demands very low power solution for the receiver operating in the frequency band 1.3MHz to 3.9MHz. The design adapts low power architecture to create low noise electronic interface for Capacitive Micro-machined Ultrasound Transducers (CMUT) sensor. Using a 0.18-µm CMOS/DMOS process, simulation results of this interface IC show that the proposed TIA can provide 104dBΩ trans-impedance gain, 1.44nArms input referred noise integrated over frequency band 1.3 MHz to 3.9 MHz, while consuming 200μA current from 1.8-V supply.

Index Terms—Analog front-end, capacitive micro-machined ultrasound transducer, trans-impedance amplifier.

The authors are with Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research) 11 Science Park Road, Science Park II, CO 117685 Singapore (e-mail: nagd@ime.a-star.edu.sg, cheongjh@ime.a-star.edu.sg, jemk@ime.a-star.edu.sg).


Cite: Dipankar Nag, Jia Hao Cheong, and Minkyu Je, "Low Noise Low Power Preamplifier for Integrated Ultrasound Needle Intervention Application," International Journal of Information and Electronics Engineering vol. 3, no. 1, pp. 20-23, 2013.

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