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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2013 Vol.3(1): 59-62 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2013.V3.266

Design of Ultra Wideband Bandpass Dual Band Filter Using Defected Ground Structures

Maryam Jaldi and Majid Tayarni

Abstract—This paper presents a novel approach for designing compact and ultra wideband filter with independently controlled central frequencies. The structure consists of a microstrip line and two defected ground structure cells that are imbedded together. Each of the cells results in respective passband, outer cell for the first passband and inner one for the second passband. By changing dimensions of the resonators the central frequency of two passbands can be independently regulated in a wide range. Several attenuation polls in the stopband are realized that improve the isolation between two passbands. A 1.8GHz, 3.3GHz dual band filter is designed and simulated with fractional bandwidth of 43% and 15%.

Index Terms—Dual band, defected ground structure, bandpass filter, microstrip, wideband

The authors are with the Department of Electrical Engineering of Iran University of Science and Technology, Narmak, Tehran, 16846-1311, Iran (e-mail: m_jaldi@elec.iust.ac.ir, m_tayarani@iust.ac.ir).

[PDF]

Cite: Maryam Jaldi and Majid Tayarni, "Design of Ultra Wideband Bandpass Dual Band Filter Using Defected Ground Structures," International Journal of Information and Electronics Engineering vol. 3, no. 1, pp. 59-62, 2013.

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