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General Information
    • ISSN: 2010-3719
    • Frequency: Bimonthly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Associate Executive Editor: Ms. Jennifer Zeng
    • Executive Editor: Mr. Ron C. Wu
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest, Ei (INSPEC, IET).
    • E-mail ijiee@ejournal.net

Faculty of Science, University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, IJIEE will be recognized among the readers in the related field."
IJIEE 2013 Vol.3(1): 8-12 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2013.V3.253

A 48μW Analog Front End Circuit Design for an Ultrasonic Receiver 0.18μm CMOS

Haridas Kuruveettil, M. Kumarasamy Raja, and Minkyu Je
Abstract—Ultrasonic transducer based sensor systems are widely used in wearable biomedical applications for indoor location sensing, tracking and other zonal compliance purposes. A system used for zonal compliance typically made up with a zonal transceiver device and a battery powered wearable device with the associated control logic at each interface. Being battery powered, the design of analog interface circuit to the wearable device is significant to overall performance of the system. In this paper, we present a fully integrated Analog Front End (AFE) interface circuit for the ultrasonic receiver designed and fabricated in 0.18μm CMOS. Measurement results shows that the single chip receiver operating at a centre frequency of 40 KHz reduce the power consumption to less than half over the discrete version.

Index Terms—Biomedical, infrared, ultrasonic, wearable device.

The authors are with the Institute of Microelectronics (A-STAR), 11, Science park road, Science park II, CO 117685 Singapore (email: kuruh@ime.a-star.edu.sg).


Cite: Haridas Kuruveettil, M. Kumarasamy Raja, and Minkyu Je, "A 48μW Analog Front End Circuit Design for an Ultrasonic Receiver 0.18μm CMOS," International Journal of Information and Electronics Engineering vol. 3, no. 1, pp. 8-12, 2013.

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