Abstract—In this paper, for application to a long distance wireless power transmission, a highly miniaturized 1-4 power divider/combiner employing periodic structure was fabricated on semiconducting silicon substrate. The 1-4 divider/combiner showed good RF performances from 1 to 25 GHz, and its size was 1.08 x 0.63 mm2 , which is 0.14 % of the size of the one fabricated on PCB.
Index Terms—Coplanar waveguide, PAGS, Silicon, RFIC, AMP
The authors are with the Korea Maritime University, Busan, Korea. He is now with the HANTANG INC., Daejeon, Korea (e-mail: firstname.lastname@example.org, email@example.com, firstname.lastname@example.org, email@example.com, firstname.lastname@example.org, email@example.com, firstname.lastname@example.org).
Cite: Jeong-Gab Ju, Jang-Hyeon Jeong, Young-Bae Park, Bo-Ra Jung, Eui-Hoon Jang, Suk-Youb Kang,and Young Yun, "Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission," International Journal of Information and Electronics Engineering vol. 3, no. 3, pp. 247-249, 2013.