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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest, Ei (INSPEC, IET), EBSCO.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2013 Vol.3(3): 279-282 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2013.V3.317

Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission

Jeong-Gab Ju, Jang-Hyeon Jeong, Young-Bae Park, Bo-Ra Jung, Eui-Hoon Jang, Suk-Youb Kang, and Young Yun
Abstract—In this paper, for application to a long distance wireless power transmission, a highly miniaturized 1-4 power divider/combiner employing periodic structure was fabricated on semiconducting silicon substrate. The 1-4 divider/combiner showed good RF performances from 1 to 25 GHz, and its size was 1.08 x 0.63 mm2, which is 0.14 % of the size of the one fabricated on PCB.

Index Terms—Coplanar waveguide, PAGS, Silicon, RFIC, AMP

The authors are with the Korea Maritime University, Busan, Korea. He is now with the HANTANG INC., Daejeon, Korea (e-mail: seikou@hanyangnav.co.kr, jjh2010@hhu.ac.kr, redphoenix@empas.com, blthor@nate.com, chchtrain17@hhu.ac.kr, int-ksy@hanmail.net, yunyoung@hhu.ac.kr)

[PDF]

Cite: Jeong-Gab Ju, Jang-Hyeon Jeong, Young-Bae Park, Bo-Ra Jung, Eui-Hoon Jang, Suk-Youb Kang, and Young Yun, "Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission," International Journal of Information and Electronics Engineering vol. 3, no. 3, pp. 279-282, 2013.

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