Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission

Authors

  • Jeong-Gab Ju, Jang-Hyeon Jeong, Young-Bae Park, Bo-Ra Jung, Eui-Hoon Jang, Suk-Youb Kang, and Young Yun Author

Keywords:

Coplanar waveguide, PAGS, Silicon, RFIC, AMP

Abstract

In this paper, for application to a long distance 
wireless power transmission, a highly miniaturized 1-4 power 
divider/combiner employing periodic structure was fabricated 
on semiconducting silicon substrate. The 1-4 divider/combiner 
showed good RF performances from 1 to 25 GHz, and its size 
was 1.08 x 0.63 mm2, wh

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Published

15.05.2013

Issue

Vol. 3 No. 3 (2013): Volume 3 issue 3 (2013)

Section

Articles

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How to Cite

Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission . (2013). International Journal of Information and Electronics Engineering, 3(3), 247-249. https://www.ijiee.org/index.php/ijiee/article/view/672