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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2018 Vol.8(1): 10-14 ISSN: 2010-3719
DOI: 10.18178/IJIEE.2018.8.1.686

The Development of Power Transformers Diagnosis Framework Using Infrared Thermograms Analysis

Phoutsavanh Chandavong and Danu Wiroteurairuang
Abstract—A power transformer is very important and considered to be the most expensive equipment of the substation. Major problems that may occur to power transformers are found in bushing heat, radiator, on-load tap change and Tank. The reason for this problem is due to a lot of working load and a long operation time of transformers. It will make these points damage and expose to high temperature. If it has been left for a long time, any catastrophe would happen in the future. To detect anomalies and predict possible faults or check the quality of transformers, this paper proposes the development mechanism framework to monitor the temperature variations, and analyze hot regions of transformers using infrared thermograms. This method is economy, convenient and efficient.

Index Terms—Infrared thermogram, power transformer, image processing.

The authors are with Ubon Ratchathani Rajabhat University,Thailand (e-mail: Chandavong9@gmail.com).

[PDF]

Cite:Phoutsavanh Chandavong and Danu Wiroteurairuang, "The Development of Power Transformers Diagnosis Framework Using Infrared Thermograms Analysis," International Journal of Information and Electronics Engineering vol. 8, no. 1, pp. 10-14, 2018.

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