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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest, Ei (INSPEC, IET), EBSCO.
    • E-mail ijiee@ejournal.net

University of Brunei Darussalam, Brunei Darussalam   
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IJIEE 2014 Vol.4(1): 27-30 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2014.V4.402

A Next Generation IDE through Multi Tenant Approach

Sidhanth N., Sanjeev S., Swettha S., and Srividya R.
Abstract— The Integrated Development Environment (IDE) as a desktop application is often used for software development process. IDE’s goal is to maximize the software productivity by providing developers with what they need all in one place. The program coding and its sharing has been indispensible in all kinds of software development; quite often the development involves team development where the interaction between the members and information regarding the status of the software development is crucial. But these IDE’s are standalone applications hence they suffer several disadvantages for they need several software and hardware prerequisites. The idea of this paper is to present an IDE for next generation using cloud computing and providing the multi tenant service to software developers using SaaS. This proposed Online IDE is different from traditional desktop IDEs and has several impressive features making it outwit the traditional desktop IDEs of its kind.

Index Terms— Collaborative-working, e-learning, IDE, multi-tenancy, online-IDE, SaaS.

The authors are with Sri Venkateswara College of Engineering, TamilNadu, India (email: sidhanth.surana@gmail.com, ronniesmack@gmail.com, swetthacse@gmail.com, srividya94@gmail.com).


Cite: Sidhanth N., Sanjeev S., Swettha S., and Srividya R., " A Next Generation IDE through Multi Tenant Approach," International Journal of Information and Electronics Engineering vol. 4, no. 1, pp. 27-30, 2014.

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