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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2016 Vol.6(3): 171-174 ISSN: 2010-3719
DOI: 10.18178/IJIEE.2016.6.3.618

A Microstrip Diplexer Using Folded Single Stepped-Impedance Resonator for 3G Microcell Stations

S. Theerawisitpong and P. Pinpathomrat
Abstract—This paper proposes a microstrip diplexer using folded single stepped-impedance resonator for 3G microcell stations. The filters are designed based second-order with side coupled excitation. The measured uplink band is at 1900-1965 MHz having a passband attenuation of 1.94 dB and return loss of 19.5 dB, while downlink band is at 2085-2135 MHz having a passband attenuation of 2.20 dB and return loss of 22.3 dB, where isolation between uplink and downlink band is 18.4 dB. In addition, second harmonic is suppressed at greater than 40 dB upto 4700 MHz. The advantages of our diplexer include low profile, compactness, high isolation, and high selectivity.

Index Terms—Microstrip, diplexer, stepped-impedance resonator, SIR.

S. Theerawisitpong and P. Pinpratomrat are with the Department of Industrial Education, Faculty of Technical Education, Rajamangala University of Technology Thanyaburi, Pathum Thani, Thailand (e-mail: somboon@rmutt.ac.th, prasert@rmutt.ac.th).

[PDF]

Cite:S. Theerawisitpong and P. Pinpathomrat, "A Microstrip Diplexer Using Folded Single Stepped-Impedance Resonator for 3G Microcell Stations," International Journal of Information and Electronics Engineering vol. 6, no. 3, pp. 171-174, 2016.

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