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General Information
    • ISSN: 2010-3719 (Online)
    • Abbreviated Title: Int. J. Inf. Electron. Eng.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIEE
    • Editor-in-Chief: Prof. Chandratilak De Silva Liyanage
    • Executive Editor: Jennifer Zeng
    • Abstracting/ Indexing : Google Scholar, Electronic Journals Library, Crossref and ProQuest,  INSPEC (IET), EBSCO, CNKI.
    • E-mail ijiee@ejournal.net
Editor-in-chief

 
University of Brunei Darussalam, Brunei Darussalam   
" It is a great honor to serve as the editor-in-chief of IJIEE. I'll work together with the editorial team. Hopefully, The value of IJIEE will be well recognized among the readers in the related field."

IJIEE 2013 Vol.3(2): 144-148 ISSN: 2010-3719
DOI: 10.7763/IJIEE.2013.V3.285

Message Domains as an Architectural Solution to Complexity in Distributed Message-Oriented Systems

Aurélio Akira Mello Matsui and Hitoshi Aida

Abstract—Effectiveness of message passing as the means to provide communication in distributed computing motivates the use of such strategy in highly distributed service environments such as grid and cloud computing. Grids and clouds share some important features such as multiplicity of administrative domains and complexity to create applications to be executed over these platforms. In this paper we argue that message domains can provide architectural simplicity to split distributed applications into layers. Interdependence between layers is controlled by visibility policies in each message domain. This architecture allows for the creation of infrastructures of distributed agents in which applications can be modular.

Index Terms—Distributed system, architecture, messageoriented system, component pluggability

The authors are with the Electrical Engineering and Information Systems, University of Tokyo, Japan (e-mail: akira@aida.t.utokyo.ac.jp, aida@ee.t.utokyo.ac.jp)

[PDF]

Cite: Aurélio Akira Mello Matsui and Hitoshi Aida, "Message Domains as an Architectural Solution to Complexity in Distributed Message-Oriented Systems," International Journal of Information and Electronics Engineering vol. 3, no. 2, pp. 144-148, 2013.

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